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如何精確的測量高速 PCB 信號結構的差分探頭的選擇、特徵和去嵌入
我要參加研討會
課程代碼
2023 Deembedding
課程時間
主辦單位
台灣羅德史瓦茲
協辦單位
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線上研討會
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線上研討會
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無上限
簡介

本次線上研討會討論了使用差分探頭對高速 PCB 信號結構進行精確測量的關鍵方面:正確的選擇探頭並知其的表徵特性,以便它可以從測量結果中完全的反嵌入。這還包括探針尖端和測量的 PCB 結構之間接觸區域的不連續性。它是由探測所引起的,不是 PCB 結構的一部分。為了獲得準確的結果,還需要表徵這種不連續性並將其從測量結果中去除。在本次線上研討會中,我們展示了測量結果並比較了結果,分別是去嵌入到探頭尖端以及正確地消除了這種不連續性。

我們將從使用差分探頭進行測量的一些典型用案例開始,介紹測試夾具表徵和去嵌入的概念,以及使用差分探頭進行精確測量的特殊挑戰和解決方案。我們還討論了差分探頭的細節及其優勢。通過參考測試板上差分跡線的實際測量,我們將解釋獲得最佳測量結果所需的步驟。

活動議程
時間活動議程下載
10:00 - 11:00如何精確的測量高速 PCB 信號結構的差分探頭的選擇、特徵和去嵌入 Download
講師介紹
Martin Stumpf
Martin Stumpf / High-Speed Digital Design Test Segment Manager, Rohde & Schwarz
Joined Rohde & Schwarz in 1990 and has worked in research & development, project management, product management, regional support and business development. He holds an EE degree from Technical University of Munich.
Brian Shumaker
Brian Shumaker / President, DVT Solutions
Brian Shumaker, the founder and CEO of DVT Solutions, is the inventor of the only true differential probe. He consults with premier Silicon Valley companies to develop test and measurement solutions that research engineers use with his probes to verify their prototypes against product designs. Brian also works with companies world-wide to provide training in advanced test and measurement techniques.
Greg Vaught
Greg Vaught / Product Planner VNA, Rohde & Schwarz
Greg Vaught is a VNA Strategic Product Planning Engineer for Rohde & Schwarz. He has been with Rohde & Schwarz for the past 17 years. Before that he worked for multiple companies in the cellular base station industry. He holds a BSEE degree from University of Illinois Urbana-Champaign and MSEE from Illinois Tech.